芯片封装低温银胶

Filler/填料

Silver/银

Viscosity/粘度@ 25°C  (Brookfield CP-51 @ 5 rpm)

30～50Kcp

ASTMD1084-97

WorkLife/施胶时间 @25°C

>100 hours

ShelfLife/保质期   @ <20°C

> 3months

CUREPROCESS固化条件

Recommended Condition/推荐固化条件

45 min@90°C

DSC，10K/min

Alternate Condition /其他可选条件

60 min@ 80 °C

*Theramp cure was observed to yield reduced voiding and increasedstrength.

渐进升温可以减少气泡产生，以及增加强度。

*HigherTemp. or longer curing would increase strength.

提高温度或延长时间，可充分固化。

PHYSIOCHEMICALPROPERTIES-PSOT CURE 固化后物理化学性质

GlassTransition Temperature/玻璃转化温度Tg

113°C

PH /酸碱度

5.8

Coefficient of Thermal Expansion/热膨胀系数

BelowTg

56ppm/°C

VolumeConductivity/体积电阻率

<0.0003Ω.cm

ASTMD257

ThermalConductivity导热系数 @ 121°C

30.7W/mK

ASTM-C518

ShearStrength/ 剪切强度 @ 25°C

>18Kg/die

ASTMD412

TensileStrength拉伸强度 @ 25°C

>2800 psi